摘要
文章主要就小功率LED在封装生产过程中经常遇到的一些异常进行了较为具体的介绍,给出其分析方法及解决方案,具有一定的借鉴和参考意义。
The thesis main point is an definite introduction of some abnormalities during the process of encapsulation for low power LEDs,and for the abnormalities,the paper also includes academic analysis and solutions,simultaneously,they will be great and valuable reference on low power development and encapsulation.
出处
《现代显示》
2009年第11期15-17,21,共4页
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