摘要
介绍了微波印制电路板制造工艺中的钻孔、孔金属化和图形制作等主要步骤以及电阻集成的方法。通过在微波印制电路板基材表面涂覆低介电常数的材料,改变了基材表面形貌和特性,采用薄膜工艺在微波印制电路板上集成了30～50Ω/的NiCr电阻。最后简要介绍了微波多层印制电路新技术。
The main steps such as the drill, the metalized via bole and the manufacturing graph of manufacturing process of microwave PCB and the methods of resistance integration were introduced. Through modifying the surface morphology and character of the microwave PCB material by coating low permittivity material, the NiCr resistances of 30-50 Ω/ were integrated on the microwave PCB by thin film technologies. Multilayer microwave PCB technology was introduced briefly.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第11期68-70,共3页
Electronic Components And Materials
关键词
微波印制电路板
电阻集成
表面改性
microwave PCB
resistance integration
modifying the surface character
