摘要
针对电刷镀铬电流效率低、沉积速率小的实际,本文采用添加剂的方法,对普通刷镀液进行了配方调整。选择了KI,KIO3,三氯乙酸等12种添加剂对电刷镀Cr的电流效率和沉积速度的影响进行了研究。结果表明,KI是电刷镀中最优良的添加剂。在常温下,向普通电刷镀Cr的镀液中添加10g/L的KI,可使电流效率提高46%,大约是普通电刷镀Cr的3倍,沉积速率提高到1000mg/h。在60℃时,添加8%KI,可以使电流效率提高到30%,沉积速度提高到700mg/L。KI仅对电刷镀Cr的沉积有催化功能,不沉积在镀层中。
For the fact that Brush plating of chromium is of low current effective and deposition rate, the additives to obtain the optimized prescription were studied. Twelve additives, such as KI, KIO3, acetocaustin, were respectively adapted. It was shown that KI was the most suitable additive. After doping KI to the solution at 10 g/L at room temperature, the current efficiency was raised by 46%, which was 3 times that of common brush plating, and the deposition rate reached 1 000 mg/h. When adding 8 g per liter at 60℃, improvement in current efficiency was 30 %, and sedimentation rate at 700 mg/h could be obtained. KI is used as an catalyst but it does not deposit on the depositing coatings.
出处
《铸造技术》
CAS
北大核心
2009年第8期1067-1069,共3页
Foundry Technology
关键词
电刷镀
添加剂
电流效率
沉积速度
Brushing plating
Additive
Current efficiency
Deposition rate
