摘要
介绍了硅片的直接键合工艺、键合机理。
Wafer Bonding has emerged as a material combination technique with wide application. In this paper, the direct bonding process of silicon wafers, bonding mechanisms, characterizing method of bonding quality, and the present research and application status of wafer bonding were introduced briefly.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
1998年第5期380-384,共5页
Chinese Journal of Rare Metals
关键词
硅片
硅片键合
直接键合
材料复合
Silicon wafer bonding, Direct wafer bonding, Silicon wafer
