摘要
为了改善大豆胶黏剂的耐水胶合强度,采用表面活性剂θ改性大豆分离蛋白(SPI)制备胶粘剂,研究了配方及热压温度对大豆胶的胶合性能的影响,利用示差扫描量热仪(DSC)和傅里叶红外光谱(FTIR)技术分别分析了大豆胶的热学性能和结构变化。结果表明:当SPI/水(质量比)为1/10、θ的添加量为SPI的0.5wt%、热压温度为160°C时,胶粘剂表现出最佳的胶合强度;大豆胶胶合过程中主要的热反应在160°C以下完成;经表面活性剂θ处理后,胶粘剂结构中的O-H和N-H键减少,大豆基胶黏剂的耐水胶合强度得到明显改善。
In order to improve the bonding strength of soybean adhesive in the polar plywoods immersed in water, a kind of adhesive was prepared by modifying the soy protein isolate with anion detergen 0. The effects of the ingredients as well as hotpressing temperature on the bonding strength of the adhesive in the polar plywoods were investigated. Thermal transition properties and alternation in chemical groups of soybean adhesive were evaluated by DSC and FTIR technologies respectively. The results showed that, the soybean adhesive exhibited the greatest bonding strength when the hot-pressing temperature was 160℃ ,the mass ratio of 0 to SPI was 2.5wt% ,and SPI to water was 1 to 10. The thermal reaction of the adhesive during the boding process mainly completed below 160℃;the concentrations of O-H and N-H bonds in the structure of the adhesive decreased when anion detergen θ was applied. After modifying with anion detergen θ, the bonding strength of soybean adhesive in the polar plywoods immersed in water was improved remarktedly.
出处
《大豆科学》
CAS
CSCD
北大核心
2009年第4期715-718,共4页
Soybean Science
基金
南京林业大学大学生科技创新项目(200872)
关键词
大豆基胶粘剂
胶合强度
热性能
结构
Soybean adhesive
Bonding strength
Thermal properties
Structure
