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光固化低黏度环氧丙烯酸酯的合成与性能研究 被引量:2

Synthesis and property study of UV curable low viscosity epoxy acrylate
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摘要 合成了可紫外光固化的低黏度环氧丙烯酸酯树脂,通过红外光谱、核磁共振氢谱、碳谱对树脂结构进行了表征;采用综合热分析仪(DSC—TG)对树脂固化膜的耐热性能进行了分析。结果表明,在树脂中添加活性单体时,随单体官能度的增加,固化膜的耐热性能增加,但双官能团单体的用量对固化膜的耐热性能没有明显影响。固化膜具有较好的耐热性,初始分解温度为330.7℃,玻璃化转变温度为76.9℃。所得树脂黏度仅为3—4Pa·s(60℃),为市售产品的1/3,附着力1级,硬度4H,耐水性能优异,无需添加单体使用。 UV curable low viscosity epoxy acrylate was prepared. The structure of the product was characterized by FTIR, 1^HNMR and 13 ^CNMR. The heat resistance of the cured film was analyzed by DSC - TG. The results showed that the heat resistance was increased with the monomer functionality increasing as adding reactive monomer into the resin. The amount of bifunctional monomer had little effect on the heat resistance of the cured film. The cured film had good heat - resistance. The initial decomposition temperature of the epoxy acrylate was 330.7℃ and the glass transition temperature (Ts) was 76. 9 ℃. The viscosity of the resin was 3 -4 Pa · s(60 ℃ ), only 1/3 of the commercial products. The adhesion and hardness of the resin were 1 grade and 4H respectively. It had good water - resistance and could be used without adding monomer.
作者 王锋 涂伟萍
出处 《热固性树脂》 CAS CSCD 北大核心 2009年第4期5-8,共4页 Thermosetting Resin
关键词 环氧丙烯酸酯 低黏度 紫外光固化 耐热 活性单体 epoxy acrylate low viscosity UV curing heat resistance reactive monomer
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