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牙本质粘接剂粘接强度与界面形态的研究 被引量:12

A research on bond strength and interface of dentin adhesives
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摘要 目的:采用一种新的界面处理方法,对不同类型牙本质粘接剂的粘接强度与界面形态进行研究。方法:选取人无龋磨牙,暴露咬合面牙本质,分别使用3种粘接剂(Single Bond,SB;Clearfil SE Bond,SE;ClearfilS 3Bond,S3)制备粘接样本。粘接样本切割成粘接界面约为0.9mm×0.9mm的柱形小条,用微拉伸测力仪测试粘接强度(n=15)。另外将粘接样本依次用6mol/L盐酸、5%次氯酸钠和0.08mg/ml透明质酸酶溶液处理,扫描电镜观察粘接界面形态。结果:3种粘接剂的牙本质粘接强度分别为:SB(35.50±6.40)MPa,SE(45.06±5.29)MPa,S3(30.46±3.82)MPa,三者之间差异具有统计学意义(P<0.05)。SB粘接界面的树脂突长约9~12μm,部分样本出现混合层易与粘接剂层分离。SE形成的树脂突长约9~14μm,无混合层与粘接剂层分离现象。使用S3后,树脂突稀疏,长约4~7μm,混合层与粘接剂层结合紧密。结论:牙本质粘接剂的粘接界面形态与粘接强度存在一定的相关性。 Objective: To evaluate bond strength and interface of various dentin adhesives by a modified interface processing meth- od. Methods:Nine extracted human molars were ground to expose fresh dentin surface. Three dentin adhesives (Single Bond, Clear- fil SE Bond and Cleaffil S3 Bond) were applied respectively and a block of composite resin was built up. The specimens were then stored in distilled water for 24 h at 37 ℃ and sectioned into beams of 0.9 mm× 0.9 mm cross- sectional area. The mierotensile bond strength was determined with Microtensile Tester( n = 15). In addition, the bonding specimens were conditioned with 6 mol/L HCl, 5% NaOCl and 0.08 mg/ml hyaluronidase to observe the adhesive interfaces by SEM. Results: Significant differences in bond strength were observed among the three adhesives(P 〈0.05) : SE Bond (45.06 ±5.29) MPa 〉 Single Bond (35.50 ±6.40) MPa 〉 S3 Bond (30.46 ± 3.82) MPa. Single Bond showed resin tags about 9 - 12 μm long and gaps between hybrid and adhesive lay- ers. No obvious boundary between hybrid layer and adhesive were observed for both SE Bond and S3 Bond, while the length of resin tags were 9 - 14 μm and 4 - 7μm for SE Bond and S3 Bond respectively. Conclusion : The morphology of the bond interface of dentin adhesive has a relationship with the bond strength.
出处 《实用口腔医学杂志》 CAS CSCD 北大核心 2009年第4期467-470,共4页 Journal of Practical Stomatology
基金 卫生部部属医院重点学科建设项目〔编号:2007-2009(46)〕 北京市首都卫生发展基金项目(编号:2007-1006)
关键词 牙本质 粘接强度 粘接界面 Dentin Bond strength Bond interface
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参考文献11

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