摘要
建立了基于AFM的单晶铜薄膜纳米压痕过程的三维分子动力学模型,采用Morse势函数计算试件原子与压头原子之间,试件原子之间的相互作用关系。研究了不同温度的纳米压痕过程中试件变形区域大小、系统能量变化。结果显示单晶铜薄膜的纳米压痕的力学机理是非晶态产生的变形。温度对纳米压痕过程有显著的影响。压痕过程中试件材料变形区域面积随着温度的增高而增加。不同温度下的系统势能-步长曲线的变化趋势基本相同,但是系统势能值随着温度的增加而减小。
Three-dimensional molecular dynamics （MD） simulations were conducted to study the effects of temperature on the AFM-based nanoindentation process of monocrystalline copper film. The Morse potential was utilized to compute the interactions between workpiece atoms and tool atoms, and also the interactions between sample workpiece atoms. The results show that the plastic deformation via amorphous transformation is the mechanism of nanoindentation of monocrystalline copper film. The nanoindentation process is significantly affected by the temperature. With the increase of temperature, the deformation area of sample workpieee increases, and the value of system potential energy decreases. However, the system potential energy-displace curves under different temperatures have the same variation trend.
出处
《系统仿真学报》
CAS
CSCD
北大核心
2009年第14期4454-4456,共3页
Journal of System Simulation
关键词
纳米压痕
分子动力学
单晶铜
AFM
nanoindentation
molecular dynamics
monocrystalline copper
AFM
