摘要
介绍了半导体测试分选编带机的技术指标要求,并运用系统工程方法建立了简单的系统结构模型,讨论了该设备的每个关键技术及实现方法。在与国外机型综合比较后,得出了可行性分析的结论。
This paper introduces the technical specifications and requirements of the semiconductor se- lected sub-test taping machine, and builds the simple system architechure model with systems engineering methods. It discusses each key technologies and implementary methods. Through comparision with the imported equipments,it gets the feasible analysable conclusion.
出处
《电子工业专用设备》
2009年第6期24-28,共5页
Equipment for Electronic Products Manufacturing
关键词
半导体
测试分选
编带
系统工程
结构模型
Semiconductor
Selected sub-test
Tape
Systems engineering
Structure module
