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电解法从废弃印刷线路板的碘化浸金液中沉积金 被引量:12

Electrodepositing gold of iodine leaching solution from waste printed circuit board
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摘要 研究电解法从废弃印刷线路板的碘化浸金液中沉积金。结果表明,电解法从废弃印刷线路板的碘化浸金液中沉积金的最佳工艺条件为:碳棒作阴极,钛板作阳极,阴离子交换膜隔开电解槽,阳极碘液中碘的质量分数为0.1%-0.8%,n(I2):n(I^-)=1:10,槽电压为10~14V,阴极碘化浸金液中金的浓度为15~50mg/L,电解时间为1~4h,金的电解沉积率大于95%。电解实验后,阳极碘液可以重复作为电解质使用或再次用来从废弃印刷线路板中浸取金。 The technical process of electrodepositing gold of iodine leaching solution from waste printed circuit board (PCB) was investigated. The results show that the most optimized conditions of electrodepositing gold of iodine leaching solution from waste PCB are elicited that the cell carbon rods(cathode) and titanium plate (anode) are used as electrode, the cell is partitioned by anion exchange membrane, the iodine concentration in anode solution is 0.1%-0.8%, n(I2):n(I^-)=1:10, the cell voltage is 10-14 V, the gold concentration in cathode solution is 15-50 mg/L, the electrolyzing time is 1-4 h, the electrodepositing rate of gold is more than 95%. After electrolytic experiment, the anode iodine solution can be recycled for electrolyte or leaching gold from waste PCB.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2009年第6期1130-1135,共6页 The Chinese Journal of Nonferrous Metals
基金 上海市重点学科建设计划资助项目(B604)
关键词 电沉积 废弃印刷线路板 碘化法 electrodeposit waste printed circuit board iodine process gold
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参考文献17

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二级参考文献21

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