摘要
远离平衡生长的Cu/a-C∶H双层膜具有网络分形的结构。在本实验条件下,测量出它的分维数D_f≈1.83。在TEM中对该双层膜进行缓慢加热的原位动态观察,发现原有的网络结构在535℃时完全遭到破坏,同时随着Cu膜的退火缩聚,逐渐出现随机分布的缩聚区,此区的分维值随着退火温度的上升而下降,最后在850℃时变为D_f=1.63。利用金属原子的表面与界面扩散模型,可以解释这种结构特征的变化。
The Cu/a--C:H blayer films, grown far from the equilibrium, havethe network fractal structure. Their fractal dimension value D_f=1 .83. An in situdynamic observation of these films under TEM with slowly heating revealed that theinitial network fractal structure was damaged gradually and broken down completelyat 535℃. And as the annealing-induced aggregation developed, the random spreadaggregated gradually, the fractal dimension of the new structure decreased with theincreasing of annealing temperature. Finally, the D_f=1.63 at 850℃. Based on thesurface and interface diffusion model of the metallic atoms, the variation of thestructural character could be explained.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
1990年第4期B281-B285,共5页
Acta Metallurgica Sinica
关键词
CU膜
分形
退火
缩聚
双层膜
Cu film
fractal
annealing-induced aggregation
