摘要
三价铬镀铬是替代六价铬镀铬理想的清洁生产工艺。研究了电流密度、电镀时间和不同基体金属对三价铬硫酸盐镀液中快速镀铬的影响。结果表明:采用三价铬硫酸盐镀液在铜、镍和低碳钢基体上进行快速镀铬都可得到表面连续致密、结构为非晶态的铬镀层,镀速在铜基体上比在镍和低碳钢基体上快很多;电流密度10A/dm2下电镀10s,铜基体上可得到0.40μm以上的铬镀层,平均镀速可达2.50μm/min;镍和低碳钢基体上只能得到0.10μm的铬镀层,平均镀速为0.50μm/min;快速镀铬的电流效率与电流密度有关,电流密度为10～12A/dm2时可达25.0%以上;三价铬硫酸盐镀液长时间连续快速镀铬时镀液体积明显减少、pH值降低。
With a view to the replacement of hexavalent chromium plating by trivalenl chromium plating as a clean technology,the effects of current density,plating time,and type of substrate materials on the plating rate of high-speed trivalent chromium electroplating in a sulfate bath were investigated.Results show that compact and amorphous Cr coating can be prepared on Cu,Ni,and mild car-bon steel substrates by high-speed trivalent chromium electropla-ting in sulfate bath,and the plating rate on copper is much higher than that on mild steel and nickel.Namely,the average plating rate on Cu substrate at a current density of 10 A/dm is as much as 2.50 μm/min,and the thickness of the Cr coating after plating for 10 s is as much as 0.40 μm.However,the plating rate on mild steel and nickel is only 0.50 μm/min,and the resulting Cr coating plated under the same conditions is only about 0.10 μm thick.Moreover,the current efficiency of trivalent chromium plating is closely related to electric current density,and it is as high as over 25.0% on copper substrate at a current density of 10～12 A/dm2.
出处
《材料保护》
CAS
CSCD
北大核心
2009年第6期32-35,共4页
Materials Protection
关键词
快速电沉积
硫酸盐
三价铬
镀铬
镀层厚度
镀速
可行性
high-speed electrodeposition
sulfate
trivalent chromium
chromium plating
thickness
deposition velocity
feasibility
