摘要
硫酸盐还原菌是最重要的生物腐蚀菌,对凝汽器传热管的腐蚀较为严重。采用电化学方法、微生物学方法和表面分析方法,在培养基中就硫酸盐还原菌(简称SRB)对凝汽器传热管材料BFe30-1-1铜合金的腐蚀电化学行为进行了研究。结果表明:SRB的存在使电极自腐蚀电位剧烈负移,腐蚀速率显著增加,极化电阻在细菌生长后期显著降低,在SRB作用下BFe30-1-1铜合金发生了严重点蚀。
The effect of sulfate-reducing bacteria (SRB) on the corrosion and electrochemical behavior of BFe30-1-1 copper alloy used for the heat-transfer tubes of condensers was studied by making use of electrochemical, microbiological and surface analytical meth-ods. Results indicate that the inoculation of SRB led to a negative shift of the free corrosion potential and significant increase of the corrosion rate of Cu alloy. During the later stage of growth of SRB, the polarization resistance of Cu alloy was greatly reduced, and the alloy was liable to severe pitting corrosion induced by SRB.
出处
《材料保护》
CAS
CSCD
北大核心
2009年第4期10-12,共3页
Materials Protection
关键词
微生物腐蚀
硫酸盐还原菌
BFe30-1-1铜合金
自腐蚀
microorganism induced corrosion
sulfate-reducing bacteria
BFe30-1-1 copper alloy
self-corrosion behavior
