摘要
对减少CO_2排放的急迫呼吁,已使主要的汽车制造商致力于开发新的电动和混合动力驱动交通工具解决方案。为这些应用开发功率半导体模块,需要新的模块集成和封装解决方案。
The urgent call for the reduction of C02 emissions has led major automobile manufacturers to work on the development of new solutions for electric and hybrid drive vehicles. In order to develop a power semiconductor module for these applications, new solutions for module integration and packaging technology are needed.
出处
《汽车与配件》
2009年第14期34-35,共2页
Automobile & Parts
