摘要
针对传统双面抛光机存在的问题,从实现超精密抛光的设备条件出发,对机床传动系统、主轴支撑结构、上抛光盘加载系统、抛光盘修整、床身等进行优化改进设计。提高了超精密双面抛光机床的精度和系统性能,为晶片获得纳米级加工精度的超光滑加工表面创造了有利条件。
In this paper, some problems in the original double-sided polishing machine have been discussed, and for realization of ultra-precision polishing equipment conditions, optimized design was accomplished in transmission system of the machine, structure of the spindle, loading system, repairing plate and the machine main structure, etc.. The stability and accuracy of the ultra-precision double-sided polishing machine have been improved by the optimized structure design and advanced double-sided polishing process, therefore the ultra-smooth surface of the wafer has been got in the new developed double-sided polishing machine.
出处
《制造技术与机床》
CSCD
北大核心
2009年第3期54-57,共4页
Manufacturing Technology & Machine Tool
基金
浙江省自然科学基金(M503049)
浙江省科技厅重点项目(2004C21007)
舟山市科技局项目(05114)
关键词
超精密加工
双面抛光机
优化设计
Ultra-precision Machining
Double-sided Polishing
Optimization of Structure Design
