摘要
定偏心平面抛光中，工件表面各区域材料的均匀去除问题涉及工件加工后的面形。本文从理论上讨论了锡磨盘与工件的转速比、偏心距及转速对工件表面面形的影响，以及工件边缘露出磨盘的情况下，表面的不均匀去除程度。模拟计算结果表明当转速比为１，工件不露出磨盘时，可以实现工件材料的均匀去除。
The even material removal in the contacting area between the surfaces of polisher and the samples being finished is important for the surface contour of the samples after polishing. This paper analyzes the differences of material removal of different positions on the sample surfaces theoretically as a function of rotating ratio of sample holder and main spindle, eccentric distance and rotating velocity. The edge effect when part of the sample surfaces do not keep in contact with the polisher continuously is discussed. The simulation shows that even material removal can be achieved while the rotating ratio is 1, and every position of sample surfaces keep touching the polisher during polishing.
出处
《光学精密工程》
EI
CAS
CSCD
1998年第2期77-82,共6页
Optics and Precision Engineering
