摘要
微细磨粒砂轮的试验研究是当前砂轮试制的主要发展趋势。本文叙述了超微细磨粒的电泳特性，并利用该特性试验研制一种新型的高密度低结合度超微细磨粒电泳砂轮，在ＭＭ７ １２０Ｈ精密磨床上，应用该砂轮对单晶硅片进行实际磨削加工，试验结果表明，通过控制磨削参数，可以降低工件表面粗糙度。
The research and experiment of an ultra-fine abrasives grinding wheel has become a tendency in the grinding field. The electrophoresis feature of ultra-fine abrasives and tile forming mechanism of the ultra-fine abrasives layer are explained, and the electrophoretic grinding wheel with higher density and lower handing strength is trial-produced to finish silicon wafer on MM7120H grinding machine. The results of experiment show that the surface roughness of silicon wafer can be improved by altering process parameters.
出处
《浙江工业大学学报》
CAS
1998年第1期23-27,共5页
Journal of Zhejiang University of Technology
基金
国家自然科学基金!59575070
浙江省自然科学基金!595081
关键词
微细磨粒
电泳砂轮
硅片
Ultra-fine abusive grains
Electrophoresis
Grinding wheel
Silicon wafer
