摘要
用线性电位扫描、ＸＰＳ、ＸＲＤ等方法，研究了砷锑铋离子对酸性硫酸铜系统中铜沉积反应动力学及铜沉积层成份与结构的影响．研究表明：Ａｓ（Ⅴ）离子能增大铜沉积反应的交换电流密度，对铜沉积过程起去极化作用；Ｓｂ（Ⅲ）、Ｂｉ（Ⅲ）离子均使铜沉积反应交换电流密度减小，对铜沉积过程起极化作用；但砷锑铋离子不改变铜沉积反应的机理．测试表明：用２００Ａ／ｍ２电流密度电解，砷锑铋不会在阴极沉积，也不影响铜沉积层的晶面择优取向（２２０）；用１５００Ａ／ｍ２电流密度电解，发现砷与铋在阴极与铜共沉积，铜沉积层的晶面择优取向变为（１１１），沉积层中铜主要以金属Ｃｕ和少量Ｃｕ２Ｏ形式存在，铋主要以Ｂｉ２Ｏ３形式存在．
The effects of As(Ⅴ), Sb(Ⅲ) and Bi(Ⅲ) on the kinetics of the cathodic copper deposition reaction in acidified CuSO4 have been investigated by linear potential sweep method, XPS and XRD. The results indicated that As(Ⅴ) ions increased the density of exchange current of copper deposition reaction and had done an action of unpolarization on the process of copper deposition. Sb(Ⅲ) and Bi(Ⅲ) ions, on the contrary, decreased the density of exchange current and had an action of polarization on the process of copper deposition. As, Sb and Bi ions showed no influence on the reaction mechanism of copper deposition. They did not deposite on the cathode when electrolysis was at 200 A/m2, they also did not effect on the copper deposition predominant crystal orientation(220). As and Bi codeposited on the cathode with Cu when electrolysis was at 1500 A/m2, with copper deposition predominant crystal orientation being changed into (111). Copper deposited in the form of metal Cu and few in Cu2O. Bismuth was in the form of Bi2O3.
出处
《应用化学》
CAS
CSCD
北大核心
1998年第2期56-59,共4页
Chinese Journal of Applied Chemistry
关键词
铜沉积
砷
锑
铋
电解法
炼铜
精炼
arsenic,antimony,bismuth,electrorefining copper,exchange current density,polarization,predominant crystal orientation
