摘要
采用Al-Ag-Cu-Ti中间夹层,在真空条件下对SiCp/2009Al复合材料进行了反应扩散连接。结果表明,中间夹层Ti元素含量、连接温度和保温时间均会影响SiCp/2009Al复合材料连接接头的连接强度;最佳的连接工艺为连接温度550℃、保温时间60min、Ti元素含量3%(质量分数),在最佳的连接工艺下连接强度可达120MPa;SiCp/2009Al复合材料的反应扩散连接接头的断裂是由于焊缝中的金属间化合物成为裂纹源,裂纹在焊缝中扩展导致接头断裂。
Reaction diffusion bonding of SiCp/2009Al composites was carried out under vacuum conditions with Al-Ag-Cu-Ti as interlayer. The results show that the joint strength of SiCp/2009Al composites is affected by the content of Ti , jointing temperature and holding time. When the optimum process is at 550 ℃ holding for 60 min with 3wt% Ti, the joint strength can reach to 120 MPa. The intermetallic compounds become as the crack source which propagate in the joint and result in the fracture of the joint.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2008年第11期100-104,共5页
Transactions of The China Welding Institution
基金
总装预研基金资助项目(Z1000A005-1)
