摘要
随着电子产品向智能化、小型化以及集成电路器件密集化发展,多层板和高密度电路板的应用越来越多。这些产品普遍采用表面安装技术,这对多层印制板平整度的要求更加严格,但在多层印制板的层压等加工过程中容易出现板面翘曲问题,对多层印制板加工中出现翘曲的原因进行了分析,重点从制作时层压的工艺过程控制方面进行论述,提出了改进措施。这些措施经生产验证,可以明显改善多层印制板的加工质量。
Following the trend of intelligentizing, miniaturization of electronic products, more and more multi -layers and high density printed circuit board are adopted. In general,the products use SMT that strictly requires the evenness of muhi - layers printed circuit board. But the problem is that the board easily curls during its processing, such as laminating. Analyzing the reason, putting more attention on the control of laminating technology procedures, improving measure are put forward. The measures can obviously improve the processing quality of multi - layers printed circuit board.
出处
《电子工艺技术》
2008年第6期343-345,共3页
Electronics Process Technology
关键词
多层印制板
翘曲
改善措施
Multi - layers PCB
Curling
Improving measure
