摘要
从浸泡在海水中的铜镍合金表面分离纯化出了硫酸盐还原菌,并深入研究了其对B10及B30合金在海水中腐蚀行为的影响。实验结果表明:铜镍合金不能抑制硫酸盐还原菌在其上附着成膜,并且硫酸盐还原菌的存在会造成B10、B30腐蚀电位明显负移,使其发生严重的脱镍腐蚀。
Effect of sulfate reducing bacteria on corrosion for naval vessel＇s pipelines was studied by using microbiological, electrochemical and ESEM technology. The results indicated that copper alloy could not inhibit the adhesion of sulfate-reducing bacteria; the presence of sulfate-reducing bacteria caused the corrosion potentials of copper nickel alloy shift negatively and serious denickel corrosion occur.
出处
《装备环境工程》
CAS
2008年第6期85-88,共4页
Equipment Environmental Engineering
关键词
铜镍合金
硫酸盐还原菌
微生物腐蚀
copper nickel alloy
sulfate-reducing bacteria
microbiologically influenced corrosion
