摘要
通过SEM和EDAX等,研究了La添加量对Sn3.5Ag0.5Cu钎料与Cu基体焊合界面IMC微观组织及性能的影响。结果表明:添加不同量的La均对Sn3.5Ag0.5Cu与Cu基体焊合后的组织有细化作用并增强其力学性能。其中以w(La)达到0.05%时最优,剪切强度可提高10.7%。材料热力学理论计算结果表明,La具有"亲Sn"倾向,添加少量La到Sn3.5Ag0.5Cu钎料中,可减小Cu6Sn5/Cu界面Sn的活度,降低IMC的长大驱动力。
Effect of La on microstructure and property of IMC between Sn3.5Ag0.5Cu solder and Cu substrate was researched by adding various amount of La in to the solder by means of SEM、EDAX and so on. The results show that La can remarkably refine the microstructure of IMC between solder and Cu substrate, and enhance its mechanical property. Especially, w（La） of 0.05% is optimal, the shear strength increases by 10.7%. The material thermodynamic calculating results show that La has affinity tendency for Sn, the activity of Sn on the interface of Cu6Sns/Cu and driving force for IMC growth decrease by adding small amount of La in Sn3.5Ag0.5Cu solder.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第11期57-59,共3页
Electronic Components And Materials
基金
辽宁省教育厅科学研究计划资助项目(No.2005233
No.20060505)
