摘要
添加了P到Sn-Cu系无铅钎料中,测定了钎料的熔化温度、抗氧化性能和接头蠕变疲劳寿命。结果表明:在Sn0.7Cu中添加微量的P,提高了无铅钎料的抗氧化性能,对熔化温度基本无影响。Sn0.7Cu0.005P无铅钎料合金熔化温度的峰值为226.7℃,在恒定应力为2MPa的蠕变疲劳试验中,钎料接头蠕变疲劳寿命为337.357min。
Adding phosphorus in Sn-Cu lead-free solder, its melting temperature, oxidation-resistance behavior and the lifetime of joint creep fatigue were measured. The results show that the oxidation-resistance behavior is improved, the melting temperature is almost not changed with adding small amount of E The peak melting temperature of Sn0.7Cu0.005P lead-free solder alloy is 226.7℃ under the constant stress of 2 MPa, and the creep fatigue lifetime of solder joint is 337.357 min.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第11期50-53,共4页
Electronic Components And Materials
基金
"十一五"国家科技支撑重点资助项目(No.2006BAE03B02)
