摘要
以GA327改性芳胺为固化剂，对应用于RTM工艺的E-44环氧树脂体系的流变特性进行了研究。在黏度实验和DSC热分析实验的基础上，依据双阿累尼乌斯方程建立了与实验数据较为吻合的流变模型。结果表明：E-44／GA327体系在60～85℃内黏度低于800mPa·S，且低黏度保持时间大于20min，在75～85℃内黏度低于300mPa·S的时间可达10min。所得到的模型可揭示树脂在不同工艺条件下的黏度变化规律，定量预报树脂的低黏度平台工艺窗口，为该树脂RTM工艺窗口的确定以及RTM工艺参数优化提供科学依据。
By using GA327 as curing agent, the theological behavior of E -44 resin system for resin transfer molding was studied with DSC analysis and viscosity experiments. A rheological model based on the dual-Arrhenius equation which was in good agreement with the results of experiments was established and used to simulate the rheological behavior of E - 44 resin system. The results show that viscosity of the resin system is under 800 mPa. s at the temperature range from 60℃ to 85℃, and the low viscosity maintaining time is more than 20 min. Furthermore, the viscosity is under 300 mPa＇s at the temperature range from 75℃ to 85℃, and the low viscosity maintaining time is more than 10 min. The processing window of E -44 resin system can be well determined based on the developed model. The rheological model is important for processing window forecast and processing parameter optimization.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2008年第5期67-70,共4页
Aerospace Materials & Technology
