摘要
针对部分元器件在焊接时发生的引脚渗锡不良现象,介绍了通过预加热器来解决引脚渗锡。利用预加热器完满实现了器件引脚焊点处的良好渗锡,消除了通孔内焊料凹陷的缺陷。
At some time, electronic component may occur a defect of fluid solder point in soldering. This paper introduces a solution method using a heater. Using heater implements well soldering, eliminates the detect of assembly through hole.
出处
《计算机工程》
CAS
CSCD
北大核心
2008年第B09期178-179,182,共3页
Computer Engineering
关键词
预加热器
通孔组装技术
焊接
电子组装
heater
assembly technology through hole
soldering
electronic packaging
