摘要
测试了硫酸盐还原菌(sulfate reducing bacteria,SRB)的生长规律,浸泡初期(前3 d)SRB处于对数增长期,浸泡后期(4 d后)SRB进入稳定生长期。利用AFM技术和EIS电化学方法研究了SRB生物膜对HSn70-1AB铜合金电极界面的影响。AFM分析表明,浸泡后期合金表面生物膜粗糙度较前期有所下降。EIS结果表明,浸泡前3 d,合金表面氧化膜层较为稳定,氧化膜层电容值变化不明显。浸泡7 d后,合金表面氧化膜遭受局部腐蚀,开始出现微孔,粗糙度增加,氧化膜层电容值增大。
Growth characteristics of sulfate reducing bacteria （SRB） were tested. The SRB was in logarithmicphase growth during the first three days and turn into stationary-phase growth since then. Atomic force microscopy （AFM） and electrochemical impedance spectroscopy （EIS） were used to investigate the effect of biofilm on phase boundary of HSn70-1 AB copper alloy and solution, respectively. The AFM hnages results showed that SRB cells adhered to the surface of copper alloy and the biofilm formed after three days immersion were observed. Roughness of three-day-old biofilm formed on the alloy was 44.7nm, while it decreased to 25.8nm after 14 days immersion. The simulative data of EIS spectrum revealed that capacitance value of oxidation film on the alloy surface was not significant change during the first three days immersion, which implied film of copper alloy was relatively stable in this period. After 7 days immersion, the oxidation loy initiated localized corrosion and micropores appeared on the surface, which was indicated capacitance value of oxidation film. that the oxidation film of copper alby the increase in capacitance value of oxidation film.
出处
《中国腐蚀与防护学报》
CAS
CSCD
北大核心
2008年第5期265-270,276,共7页
Journal of Chinese Society For Corrosion and Protection
基金
北京大唐国际电力有限公司资助(TX06-15)
关键词
硫酸盐还原菌
生物膜
AFM
交流阻抗谱
双电层电容
转移电阻
sulfate reducing bacteria （SRB）, biofilm, atomic force microscopy （AFM）, electrochemical impedance spectroscopy （EIS）, capacitance, transfer resistance
