摘要
介绍了军用粘接方舱大板的结构,工艺要求,大板成形加温加压控制过程。又结合粘接工艺建立了大板成形工艺流程图,并对胶层厚度对大板应力分布的影响进行了探讨。主要探讨大板的制造工艺及胶粘剂的选用。
Introduced the construction of board-shield technological requirements, the controlling process of the board forming, heating and compression. Combing the stick technology to establish the technology process diagram of board forming and discuss the influence of the stick thickness for board stress distribution. The article mainly discussed the manufacture technology of board and the selection of stick.
出处
《移动电源与车辆》
2008年第3期33-37,共5页
Movable Power Station & Vehicle
关键词
粘接方舱大板
结构件
芯材
胶粘剂
成形工艺
stick board shield
construction
material
stick
forming technology
