摘要
介绍了一种用于覆铜板厚度检测的光电式非接触测量装置及其工作原理。每个测量点由上下一对测量探头和一套检测处理电路组成。其中，测量探头由一个半导体激光器作光源，面阵ＣＭＯＳ图像传感器按场进行图像采集，经检测处理电路处理得到物体的位置，再由计算机计算并显示被测物体的厚度。该系统具有测量精度高、体积小、成本低。
: A photoelectric instrument for measuring thickness of copper-coated plate is introduced in this paper as well as its operation principle.Each measuring channel consists of a pair of detectors with one on the top and the other at the lower part,and a set of detecting and processing circuits.The detector uses a laser diode as the light source.A CMOS image sensor is used to gather pictures per field so that the position of the object can be obtained via the processing circuit.The thickness of the coated plate can be calculated and shown on the computer.The instrument is characterized by high accuracy,small size,low cost and ease of expansion for measuring points.
出处
《半导体光电》
CAS
CSCD
北大核心
1997年第6期426-429,共4页
Semiconductor Optoelectronics
