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基于UML的CMP控制系统设计与实现

Design and realization of UML-based CMP Control System
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摘要 CMP(Chemical Mechanical Polishing)设备是半导体集成电路(IC)制造中的关键设备,CMP设备控制软件的开发是CMP设备研发的关键技术之一。在分析三工位CMP设备控制系统需求的基础上,对控制系统中的3个工位的模块构建等问题进行了探讨,给出了控制软件的设计方法。在对CMP系统功能架构进行详细分析的基础上,利用UML对系统控制结构进行了分析设计,并用例模型、结构模型和行为模型等对系统进行了可视化建模,然后用Rational Rose 2003的正向工程实现模型到C++代码的转换,最后在此基础上用Visual C++进行系统开发和实现。 CMP (Chemical Mechanical Polishing)equipment is key to the semiconductor integrated circuit (IC) manufacturing, and the development of its control software is one of the key technologies of CMP equipment design. Based on the analysis of the control requirements of three-station equipment, the module structures etc of the CMP control system are discussed, and then the design approach of the control software is proposed. Based on the detailed analysis of function structure of CMP control system, the structure of the CMP control system is analyzed and designed in UML, then visual modeling of control system is realized on the basis of case model, structure model and behavior model. The translation from model to C++ code is realized by Forward Engineering of Rational Rose 2003, and finally the control system is developed and realized in Visual C++.
出处 《电子工业专用设备》 2008年第8期48-52,共5页 Equipment for Electronic Products Manufacturing
基金 国家自然科学基金资助重大项目(50390061) 国家杰出基金资助项目(50325518)
关键词 化学机械抛光 统一建模语言 RATIONAL ROSE CMP UML Rational Rose
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  • 1王博.面向对象的建模设计技术与方法[M].北京:学苑出版社,1993,12..
  • 2郑人杰.实用软件工程[M].北京:清华大学出版社,1999..
  • 3-.过程工程原理及过程工程环境专题[J].软件学报,1997,6.
  • 4杨芙清 何新贵.软件工程进展[M].清华大学出版社,..
  • 5谢中生.CMP平坦化工艺技术的发展应用与设备前景[J].电子工业专用设备,1997,26(1):12-14. 被引量:4
  • 6[1]HaHN P O. The 300mm silicon wafer-A cost and technology challenge[J]. Microelectronic Engineering, 2001,56(1-2): 3-13.
  • 7[2]GEHMAN B L. In the age of 300mm silicon, tech standards are even more crucial[J].Thin Solid Fims, 1998,335(1-2): 127-128.
  • 8[3]VERHAVERBEKE S, et al, Chuck for holding wafer[P]. U.S. Patent: 20020066475,2002.
  • 9[4]WALSH R J. Method and apparatus for wax mounting of thin wafers for polishing[P].U.S. Patent: 4, 316, 757, 1982.
  • 10[5]Wardly G A. Electrostatic wafer chuck for electron beam micro fabrication[J].Rev Sci Instrum, 1973, 44(10): 1506-1509.

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