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低温固化双马来酰亚胺树脂基体研究 Ⅱ . 扩链 BMI/DP 共聚体系 被引量:10

STUDY OF LOW TEMPERATURE CURABLE BISMALEIMIDE RESINS I I. CHAIN EXTENDED BMI/DIALLYL BISPHENOL A SYSTEM
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摘要 采用二元胺扩链改性,以提高前文[1]研究的低温固化共聚型BMI树脂的韧性。研究了扩链BMI树脂的配方、反应性、工艺性及其浇铸体和复合材料的性能。结果表明,改性BMI树脂的固化温度降到了150℃,韧性得到提高,复合材料性能优异。浇铸体弯曲强度119MPa,热变形温度272℃;玻璃纤维复合材料弯曲强度2034MPa,短梁剪切强度91.8MPa。 The cure temperature of bismaleimide (BMI) resins is known to be higher than 200℃, although their heat resistance and many other properties are excellent. The authors previous study has shown that initiator is very effective in lowering the cure temperature of BMI resins, but its cured resin is brittle. This paper tried to use diamine extender and diallyl bisphenol A comonomer to increase toughness of modified resin. An optimum resin formulation cured at 150℃ was obtained using a computer aided quadratic regression orthogonal combination design method. The resin casts have been detected to have the properties of middle toughness and excellent heat resistance, and composites to have good mechanical properties. This work has laid a good foundation for manufacturing composite tools and structures.
出处 《复合材料学报》 EI CAS CSCD 北大核心 1997年第3期61-66,共6页 Acta Materiae Compositae Sinica
关键词 双马来酰亚胺 烯丙基双酚 低温固化 扩链 树脂 bismaleimide, low temperature curable, extender, diallyl bisphenol A
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