摘要
采用化学镀方法,对微米级丙烯酸酯橡胶(ACM,Acrylate rubbers)微球进行表面金属铜镀覆;通过对镀铜反应进程的控制,制备出了镀层致密、包覆均匀的低密度ACM核-铜壳结构复合导电微球(简称镀铜ACM复合微球);研究了镀铜ACM复合微球表面铜镀层的结构、形貌及微球的电性能.结果表明:应用化学镀的方法可以对ACM微球进行表面金属铜镀覆;通过控制镀液中OH-的补加量,能够准确控制化学镀铜反应进程及表面镀层包覆程度;不同包覆程度的镀铜ACM复合导电微球的体积电阻率均随外加压力增大而降低,几乎不随通电时间变化,但随温度升高表现出阻-温特性.
Electroless copper plating on acrylate rubber （ACM） microspheres of micron scale was studied. By introducing a reaction control method, the continuously and uniformly covered ACM conductive microspheres with low density and core-shell structure were achieved. The morphology and composition of Cu coatings and the electrical properties of the Cu-coated ACM microspheres were investigated. It was found that Cu can be plated on the surface of ACM microspheres by electroless plating. The reaction process of electroless copper plating can be controlled by adjusting the OH - additional amounts, thus to control the morphology of Cu coatings. The Cu-coated ACM microspheres all present resistance characters that the volume resistivity de- clines with pressure, but remains constant with electrifing time. And the Cu-coated ACM microspheres present the special resistance behaviors with the rising of temperature.
出处
《北京航空航天大学学报》
EI
CAS
CSCD
北大核心
2008年第8期911-915,共5页
Journal of Beijing University of Aeronautics and Astronautics
关键词
橡胶微球
铜镀层
化学镀
电阻率
rubber microspheres
Cu coatings
electroless plating
electric resistivity
