摘要
采用正交试验法和Moldflow仿真模拟实验相结合,对PDA外壳面板的表面缩痕作了多成形工艺参数综合影响分析,用较少次数的仿真实验获得了能基本反映全面情况的试验资料,并研究不同成形工艺参数对注塑过程制品表面缩痕指标的影响程度,进而得到一组优化的成形工艺参数,避免了各因素单独分析的片面性,有效地解决了以往成形工艺参数设置不合理的现象。据此进行模具设计,可加快模具开发进度,缩短产品开发周期,提高企业的产品质量和竞争能力。
By the combination of orthogonal experiments and Moldflow simulation tests, the surface shrink marks of a PDA panel under the combined effects of multi-molding process parameters are analysed. By this method, it can gain the experiment data which can basically reflect the overall situation using fewer number of simulation test. In addition, the effects degree of different molding process parameters for surface shrink marks are researched, and the optimized parameter combination is obtained. It can avoid the one-sidedness of individual analysis of/the various factors and solve the unreasonable appearance of process parameter settings. With the help of results, it can fasten the mold developing schedule, thus shorten the cycle of product development, and improve the quality of products and the competitive ability of enterprise.
出处
《电加工与模具》
2008年第4期60-62,72,共4页
Electromachining & Mould
基金
浙江省教育厅科研计划项目资助(20070955)
关键词
Moldflow仿真
正交试验
缩痕
最小化
工艺参数
Moldflow simulation
orthogonal experiment
shrink marks
minimization
process parameters
