摘要
铸造不同成分的铜锡合金，通过人为腐蚀，利用ＬＳＶ（电位扫描）、ＸＲＤ、ＳＥＭ等多种手段进行分析，结果表明：１）含Ｓｎ量为１０％左右的青铜器在酸性含Ｃｌ－环境中易产生晶间腐蚀生成粉状锈，而２０％～４０％含Ｓｎ量的青铜合金无明显晶间腐蚀现象出现；２）含Ｓｎ量高于１０％的合金，在ＮａＣｌ溶液中在低电位处出现欠电位阳极电流峰（ＵＰＣ），且形成Ｖ型ＣａＣｌ晶相的电极表面膜。在较正电位处，铜锡合金及纯铜出现主阳极电流峰（ＭＰＣ），并形成较稳定的构型不同于Ｖ型ＣｕＣｌ的表面ＣｕＣｌ铜盐保护膜。
The analysis had been made on different ingredient Cu Sn alloys by means of artificial corrosion,linear potential sweep technique(LSV),XRD and SEM The result showed that:(1)bronze in which Sn content is about 10% is easy to produce intergranular corrosion to form powdered rust in the acidic environment;(2)for the alloy in which Sn contant is more than 10%,under potential peak of anode current density (UPC) appear on place of lower potential in NaCl solution and formed electroed surface film of V type phase CuCl Cu Sn alloy and pure copper present main peak of anode current density on upper positive potential,and formed more stable cupric CuCl surface protective film which structure different from V type CuCl
出处
《材料工程》
EI
CAS
CSCD
北大核心
1997年第11期23-26,42,共5页
Journal of Materials Engineering
基金
国家自然科学基金
山东省科学基金
关键词
青铜合金
晶间腐蚀
阳极电流峰
bronze alloy intergranular corrosion peak of anode current density powdered rust
