摘要
为了解决大功率半导体激光器的散热问题,利用有限元软件ANSYS,采用稳态热模拟方法,分析了半导体激光器内部的温度分布情况,对比分析了In、SnPb、AuSn几种不同焊料烧结激光器管芯对激光器热阻的影响。由模拟结果可见,焊料的厚度和热导率对激光器热阻影响很大,在保证浸润性和可靠性的前提下,应尽量减薄焊料厚度。另外,采用高导热率的热沉材料和减薄热沉厚度可有效降低激光器热阻。在这几种焊接方法中,采用In焊料Cu热沉焊接的激光器总热阻最小,是减小激光器热阻的最佳选择。通过光谱法测出了激光器热阻,验证了模拟结果,为优化激光器的封装设计提供了参考依据。
In order to solve the heat radiation of high power semiconductor lasers, the internal thermal distribution of the lasers and the influence of the laser diodes sintered by different solders （In, SnPb, AuSn） on the thermal resistance of the lasers were analyzed by ANSYS finite element software and the steady thermal simulation method. The simulation results show that the thickness and thermal conductivity of the solders are the main factors impacting the thermal resistance. On the premise of ensuring wettability and reliabilities, the thickness of the solders should be decreased. The thermal resistance of the lasers can be reduced effectively by using heat sink materials of high thermal conductivity and thinning its thickness. Of several welding methods, the total thermal resistance of the lasers sintered by In solder and Cu carrier is minimum, and the method is the best selection to reduce the thermal resistance of the lasers. The actual values of thermal resistance were obtained by spectrographic analysis, and the simulation results were validated. The obtained conclusion can help to optimize packaging design of the lasers.
出处
《微纳电子技术》
CAS
2008年第7期428-431,共4页
Micronanoelectronic Technology
基金
国家部委基金资助项目
关键词
大功率半导体激光器
焊料
热模拟
热阻
光谱法
high power semiconductor laser
solder
thermal simulation
thermal resistance
spectrographic analysis
