摘要
介绍了采用有机玻璃（聚甲基丙烯酸甲酯，PMMP）作基底，对施镀表面进行催化活化处理，沉积的铜再产生自身钝化作用而得到一定厚度的铜层制备微型铜空腔的工艺。讨论了化学镀液的主要成分对镀速及镀层质量的影响。结果表明，由此工艺所制备的铜层壁厚范围在10～30μm，长度在2mm左右，镀层铜含量大于95％，为制备惯性约束聚变（ICF）金属腔靶提供了一种新方法。
Polymethyl methacrylate (PMMA) mandrel was used as substrate and coated with electroless Cu coating after catalytic activation, generating Cu coating of a certain thickness in the presence of the self-catalytic action of the coating itself. The PMMA mandrel coated with Cu coating was then corroded and dissolved using chloroform, generating micro-hohlraum made of electroless Cu coating. The effects of the main ingredients in ammonium sulfite plating bath on the plating rate and properties of the coating were investigated. It was found that the Cu coating micro-hohlraum had a wall thickness of 10～30 μm and length of about 2 mm, and contained Cu above 95%. The established electroless Cu plating process could be used to prepare inertial confinement fusion (ICF) fabricate metallic hohlraum.
出处
《材料保护》
CAS
CSCD
北大核心
2008年第6期26-27,共2页
Materials Protection
