摘要
随着微电子塑料封装IC器件吸潮可靠性影响的深入研究，综合分析热、湿及蒸汽压力对塑封器件的可靠性影响是必不可少的工具。本文从理论、模拟分析的角度，回顾并分析了综合考虑热，湿及蒸汽压力对塑封IC器件可靠性影响的分析方法；从已有的理论方法和研究结论来看，综合考虑热、湿及蒸汽压力对器件失效影响更精确的表征了器件的实际失效情况，正成为微电子封装可靠性研究领域的热点，其研究思路受到了越来越多的关注和重视。
With profound researches on the influence of moisture-absorbing reliability of micro-electronic plastic packaging IC components, we have an comprehensive analysis on the dispensable role of thermal-humidity and vaporizing pressure which influence the reliability of plastic electronic packaging components. This article, from the perspective of theoretical and stimulating analysis, has a review as well as an analysis on the ways of analyzing the influences of the reliability to combine heat, moisture and vapor pressure with the plastic packaging IC components. Seen from the existed theories, methods and conclusions, the fact that the thermal-moisture and vapor pressure fail to influence the components more accurately represents the actual invalid conditions of components, which is becoming a hotpoint in the field of the reliability for microelectronic molding. More and more attentions are now being paid by researchers to the researching ideas and conclusions
出处
《现代表面贴装资讯》
2008年第2期60-63,共4页
Modern Surface Mounting Technology Information
关键词
蒸汽压力
综合分析
模型耦合
公式耦合
层裂
vapor pressure, comprehensive analysis, model coupling, formula coupling, delamination
