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铜合金时效处理温度对析出过程的影响 被引量:2

Effect of aging temperatures on precipitation process of copper alloy
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摘要 通过测试Cu-Cr-Zr合金在等温加热过程中电阻率的变化,提出了一种计算相对电阻率减小值Δγ的方法,并以Δγ作为描述时效过程的参数,对该合金等温加热时效动力学进行了研究。结果表明,Cu-Cr-Zr合金在等温时效开始阶段,相对电阻率的变化量Δγ急速增加,随着时效时间的增加,Δγ上升幅度逐渐变小,时效结束时Δγ趋于稳定,且相对电阻率的变化量Δγ的增加速率随等温时效温度升高呈现增加趋势;随等温时效温度升高,孕育时间呈现缩短趋势。在此基础上,建立了等温加热时效动力学图,其形状并未呈现常见的"C"形。 According to the linearity relationship of relatively resistivity vs.temperature,a decreased relatively resistivity(namely Δγ) calculating method was proposed based on experiment of testing the change of resistivity of the Cu-CrZr alloy in the isothermal-heating aging process.Using the calculated Δγ as the parameter to describe the isothermal aging process,the isothermal-heating aging kinetics of the tested alloy was established.The results show that the Δγ value of the tested Cu-Cr-Zr alloy increased remarkably at the beginning of the isothermal aging process,then the change of Δγ decreased with increasing aging time,and the Δγ value became constant at the end of the aging process.The increasing rate of the Δγ value increased and the incubation time decreased with increasing isothermal aging temperature.Moreover,the non-"C" shape isothermal-heating aging kinetics curves of the tested alloy are observed.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2008年第2期43-46,共4页 Transactions of Materials and Heat Treatment
基金 河南省教育厅自然科学基金项目(2006430004) 河南科技大学科研基金资助项目(2006ZY046)
关键词 等温加热 时效 动力学 相对电阻率 isothermal-heating aging kinetics relative resistance ratio
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  • 1赵冬梅,董企铭,刘平,金志浩,康布熙.高强高导铜合金合金化机理[J].中国有色金属学报,2001,11(z2):21-24. 被引量:124
  • 2卫英慧,王笑天.Al-Li合金早期时效阶段调幅分解的理论分析[J].金属热处理学报,1995,16(3):22-28. 被引量:1
  • 3[5]Fujiwara H, Kamio A. Effect of alloy composition on precipitation behavior in Cu-Ni-Si alloy[J]. Japan Inst Metals, 1998, 62(4): 301-309.
  • 4[12]Zhao J C, Notis M R. Spinodal decomposition, ordering transformation, and discontinuous precipitation in A Cu-15Ni-8Si alloy[J]. Elsevier Science Ltd, 1998, 46(12): 4203-4218.
  • 5Tang N Y,Mater Sci Tech,1985年,1卷,270页
  • 6曹育文 马营生 唐祥云 等.中国铜合金引线框架材料的现状与发展[J].功能材料,1998,10:714-718.
  • 7Liu G, Zhang G J, Ding X D, Sun J, Chen K H. Mater Sci Eng A, 2003; A343:113
  • 8Zhu A W, Starke Jr E A. Acta Mater, 1999; 47:3263
  • 9Zhu A W, Csontos A, Starke Jr E A. Acta Mater, 1999;47:1713
  • 10Jena A K, Chaturvedi M C. Phase Transformation in Materials. New Jersey: Prentice-Hall press, 1992:151

共引文献201

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  • 1王军,殷俊林,严彪.Cu-Ni-Sn合金的发展和应用[J].上海有色金属,2004,25(4):184-187. 被引量:39
  • 2张利衡.少量Mn对Cu-15Ni-8Sn合金时效硬化的影响[J].上海有色金属,1996,17(2):62-67. 被引量:15
  • 3张少宗,江伯鸿,丁文江.铸造Cu-15Ni-8Sn合金的组织和力学性能[J].特种铸造及有色合金,2006,26(1):62-64. 被引量:13
  • 4张少宗,江伯鸿,丁文江.国内Spinodal分解Cu-Ni-Sn系合金研究进展[J].材料导报,2006,20(8):84-86. 被引量:17
  • 5Kratochvil P, Menel J, Pesieka J, et al. The structure and low-temperature strength of the age hardened Cu-Ni-Sn alloys [ J ]. Acta Metal, 1984,32 ( 9 ) : 1493 - 1497.
  • 6Jeon W S, Shur C C, Kim J G, et al. Effect of Cr on the corrosion resistance of Cu-6Ni-4Sn alloys[ J ]. Journal of Alloys and Compounds,2008,45 (5) 358 - 363.
  • 7Nishijim A F, Nomura K, WATANABE, et al. Investigation on stress relaxation behavior in Cu-Ni-Sn-P ahoy [ J ]. Journal of the Japan Institute of Metals ,2008,72 (6) :427 - 432.
  • 8Laughlin D E,Cahn J W.Spinodal decomposition in age hardening copper-titanium alloys[J].Acta Metallurgica,1975,23(3):329-339.
  • 9Cornie J,Datta A,Soffa W.An electron microscopy study of precipitation in Cu-Ti sideband alloys[J].Metallurgical Transactions,1973,4(3):727-733.
  • 10Soffa W,Laughlin D.High-strength age hardening copper-titanium alloys:redivivus[J].Progress in Materials Science,2004,49(3):347-366.

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