摘要
IP复用已成为SOC(system-on-chip)芯片设计的主要手段之一。以一款0·18μm工艺下的温度控制芯片设计为例,具体介绍硬核复用设计的工艺移植问题,并给出了一种基于工艺设计工具包的设计流程及其关键技术解决方案。该设计流程在保证电路功能正确性的同时,又可以减少版图设计的设计周期,可以为其他类似硬核的复用设计提供参考。
IP reuse has become one of the main solutions in SOC design. A design of a temperature controller under 0.18 ttm process was given, the process migration in the hard IPs reuse was focused, the process design kit- based design flow along with the key technologies and solutions were proposed. Ensuring the validity of the circuit functions, meanwhile the design flow can reduce the layout design cycle, it provides a reference for similar hard IPs reuse designs.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第5期446-449,共4页
Semiconductor Technology
基金
福建省自然科学基金计划资助项目(A0410007)
