摘要
用电化学、微生物学和表面分析方法研究了培养基中硫酸盐还原菌(SRB)对HSn70-1A铜合金的电化学腐蚀行为,探讨了硫酸盐还原菌生物膜下介质的流动状态及材料表面状态对铜合金腐蚀的影响。结果表明,SRB的存在使电极自腐蚀电位快速负移,腐蚀速率显著增加,细菌生长后期极化电阻显著降低。扫描电子显微分析(SEM)表明,在SRB作用下铜合金发生严重点蚀。介质的流动状态对细菌的附着、生长具有一定的影响,加剧了腐蚀的形成和发展。铜合金在2-巯基苯并噻唑(MBT)与1,2,3-苯并三氮唑(BTA)复配缓蚀剂中预镀膜后,耐SRB侵蚀性显著提高。
The effect of sulfate-reducing bacteria （SRB） on corrosion behavior of HSn70-1A alloy were studied by electrochemical, microbiology and surface analysis methods. The results showed that the free corrosion potential of the alloy shifted negatively when SRB was inoculated,the polarization resistance decreased obviously, which corresponds to an increased corrosion rate. The serious pitting corrosion occurring on the alloy surface under the action of SRB was observed by SEM. Furthermore, influence of medium flow characteristic and material surface appearance on corrosion behavior of HSn70-1A alloy under the biofilm of SRB were researched. It was showed that the average corrosion rate was higher and the SRB count in the biofilm was less when test piece was immersed in the flowing batch culture medium inoculated with SBB than in the static batch culture medium inoculated with SRB . Thus the flow of medium could speed up the corrosion rate . After being coated in the mixture corrosion inhibitor of MBT and BTA beforehand, the copper electrode had more positive free corrosion potential and higher linear polarization resistance in the culture medium inoculated with SRB than the one without being coated, which demonstrated that the resistance of HSn70-1A alloy against microbiologically influenced corrosion increased obviously.
出处
《中国腐蚀与防护学报》
CAS
CSCD
北大核心
2008年第1期38-43,共6页
Journal of Chinese Society For Corrosion and Protection
关键词
微生物腐蚀
HSn70-1A合金
硫酸盐还原菌
镀膜
自腐蚀电位
microbiologically induced corrosion, HSn70-1A alloy, sulfate-reducing bacteria, film, free corrosion potential
