摘要
硅压阻式OEM型压力芯体被广泛应用,但该封装结构的传感器在使用时需要二次设计引压接嘴和装配。提出了传感器改变了这一传统设计,将隔离膜片、引压接嘴及基体等一体化焊接,结构简单,装配环节少,成品率高,大大降低了产品的生产成本。试验结果表明:该传感器的性能达到了目前同类产品的水平。给出了该设计的具体结构形式、芯片的选用原则及各主要零部件的设计准则和注意事项。
Si Piezoresistive sensor is widely used, in course of using the packged sensor, interface unit that transmits pressure should be designed and assembled. New structure sensor that changes traditional way of design is introduced, the structure is integrated, being composed of isolation membrane, transmits pressure unit and base stock, simple structure and assembly procedure, super rate of finished products, cost of production is consumedly reduced. Experimentation results indicate that the performance of sensor accords to presently like - kind products. Concrete mode of structure is introduced, choice standard of chip, and design rules and matters of main parts.
出处
《黑龙江大学自然科学学报》
CAS
北大核心
2008年第1期42-45,49,共5页
Journal of Natural Science of Heilongjiang University
关键词
一体化
压力
传感器
设计
integrate
pressure
sensor
design
