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超音速电弧喷射雾化Cu-10Ag合金熔滴的快速凝固 被引量:2

Rapid Solidification of Cu-10Ag Alloy Droplets by Ultrasonic Arc Spray Atomization
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摘要 采用超音速电弧喷射雾化制备了Cu-10Ag合金粉末,并用SEM和X-射线衍射等对合金液滴的凝固行为进行了研究;对凝固机制进行了分析。结果表明,粉末为球形颗粒,粒径分布主要集中在15~70μm之间,平均直径为45μm;液滴初始冷却速率为105~107K/s;凝固组织是由约含7%的Ag的富Cu晶胞和约含50%~60%的Ag的晶胞壁构成的胞状晶组织,随粉末颗粒直径由80μm减小到15μm,晶胞平均尺寸由约2μm减小为约1μm。 Rapidly solidified behavior of Cu-10Ag alloy droplets prepared by ultrasonic arc spray atomization was observed by SEM and X-ray.The powder consists of spheroidal particle with size in the range of from 15 to 70 μm and average size of 45μm.The initial cooling rate of alloy droplets can be realized from 105 K/s to 107 K/s.The solidification structure of alloy droplets is composed of Cu-rich cell containing about 7% Ag and cell wall containing 50%~60% Ag,exhibiting cellular structure.In addition,the average cell size is decreased from about 2 μm to about 1 μm with the particle size decreasing from 80 μm to 15 μm.The solidification mechanism was analyzed also.
出处 《特种铸造及有色合金》 CAS CSCD 北大核心 2007年第12期906-908,共3页 Special Casting & Nonferrous Alloys
基金 云南省应用基础研究基金资助项目(2003E0082M)
关键词 超音速电弧喷射雾化 Ag—Cu合金 快速凝固 Ultrasonic Arc Spray Atomization,Ag-Cu Alloy,Rapid Solidification
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  • 1JONES H. The status of rapid solidification of alloys in research and application[J]. J. Mater. Sci. , 1984, 19(4):1043-1076.
  • 2BOSWELL P G, CHADWICK G A. The structure of the γ' extended solid solution in a splat-cooled Ag-50at% Cu alloy[J]. J. Mater. Sci., 1977, 12(9):1879-1894.
  • 3THOMA D J, GLASGOW T K, TEWARI S N. Effects of process parameters on melt-spun Ag-Cu[J]. Mater. Sci. Eng. , 1988, 98: 89-93.
  • 4JACOBSON N. Rapid solidification of Ag-Cu and Ag-Pb[J]. Ma ter. Sci. , Eng. ,1991, A133:574-576.
  • 5BOETTINGER W J, SHECHTMAN D, SCHAEFER R J. et al. The effect of rapid solidification velocity on the microstructure of Ag-Cualloys[J]. Metall. Trans. A, 1984, 15(1):55-66.
  • 6WALDER S, RYDER P L. Nonequilibrium solidification in undercooled melts of the alloy Ag-39. 9at% Cu[J]. J. Appl. Phys. , 1993,73:1965-1970.
  • 7WALDER S, RYDER P L. Critical solidification behavior of under cooled Ag-Cu alloys[J]. J. Appl. Phys. , 1993, 74:6100-6106.
  • 8PANDEY O P, LELE S, OJHA S N. Undercooling and solidification of droplets of Cu-Ag alloy entrained in the primary phase[J]. J. Mater. Sci., 1995, 30(2) :538-543.
  • 9徐滨士,梁秀兵,马世宁,刘世参,张伟,张振学.新型高速电弧喷涂枪的开发研究[J].中国表面工程,1998,11(3):16-19. 被引量:65
  • 10陈永雄,徐滨士,许一,魏世丞,刘燕.高速电弧喷涂技术在装备维修与再制造工程领域的研究应用现状[J].中国表面工程,2006,19(z1):169-173. 被引量:26

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