摘要
研究采用BC路径(即试样进入下一道次挤压时按同一方向旋转90°)对纯铜进行等径角挤压后得到的组织与性能.结果表明,通过室温下对纯铜的8道次挤压后,得到均匀、细小的等轴晶组织(晶粒尺寸约1.5μm).抗拉强度从原来的235 MPa提高到420 MPa,硬度从114 HV提高到184.3 HV,延伸率由原来的45%降低到19%.通过对不同挤压道次试样在473 K下60 min的退火处理后,其晶粒进一步细化至1μm,其抗拉强度提高到435 MPa.
The microstructure and properties of pure copper pressed with equal channel angular pressing were investigated by using BC route （samples rotated by 90^o in an identical direction before the next presspass）. The results showed that uniform and fine equiaxed grains with the size of 1.5μm were obtained after 8 times ECAP at room temperature. The ultimate tension strength （UTS） of copper was increasd from 235 MPa to 420 MPa, Vickers microhardness increased from 114 HV to 184. 3 HV, and the elongation reduced from initial 45% to 19%. Samples pressed with ECAP for different times were annealed at 473 K for 60 min, and the grains could be further refined to 1μm with their UTS being 435 MPa.
出处
《兰州理工大学学报》
CAS
北大核心
2007年第6期10-13,共4页
Journal of Lanzhou University of Technology
关键词
等径角挤压
纯铜
再结晶
equal channel angular pressing
pure copper
recrystallization
