摘要
分析了圆片冲击法硅片强度测试中简支半径对动载荷挠度及强度测试值的影响，实验求得直径50．8mm硅片抗弯强度测试值的校正系数为0．8．
The effects of simple support radius on the impact load deflection and fie-cure strength measured by impact method were studied preliminarily. The correct factor K=0. 8 for measuring strength of silicon slices with diameter 50. 8 mm was obtained by experements.
出处
《中南工业大学学报》
CSCD
北大核心
1997年第3期260-261,共2页
Journal of Central South University of Technology(Natural Science)
基金
国家教委硅材料国家重点实验室基金
