摘要
采用真空熔炼的方法制备了一种新型的高强高导兼顾的铜合金材料Cu-Ag-Zr合金。利用显微硬度测试、金相和透射电镜分析等方法，研究了微量zr对Cu．Ag合金力学性能的影响．结果表明，微量Zr的加入，能显著提高Cu-Ag合金的显微硬度和再结晶温度，使Cu-Ag合金的再结晶软化温度提高200℃以上，Cu-Ag-Zr合金经550℃退火2h后，其显微硬度仍保持为128Hv，能够满足高强高导铜合金高温性能的要求；微量Zr对Cu-Ag合金的强化主要通过使该合金中形成细小、弥散分布的析出相来实现的。
A new high-strength and high-conductivity copper alloy Cu-Ag-Zr alloy are produced by means of a vacuum induction furnace. The influences of trace Zr addition on the mechanical properties of the Cu-Ag alloy have been studied by microhardness measurement, optical microscope and transmission electron microscope observation. The results show that the microhardness and rescrystallization temperature increase effectively with the trace addition of Zr, the recrystallization temperature of Cu-Ag alloy increases about 200℃, and the rnicrohardness retain 128Hv after annealing at 550℃ for 2h, which are satisfied for the high-temperature property of the high strength and high electrical conductivity copper alloy. The fine and dispersed precipitates caused by the trace addition of Zr should be responsible for the strengthening of Cu-Ag alloy.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期494-496,共3页
Journal of Functional Materials
基金
国家高技术研究发展计划（863计划）资助项目（2002AA331110
2006010325036）
河南省杰出人才创新基金资助项目（0521001200）
国家自然科学基金资助项目（50571035）
河南科学大学博士科研启动基金资助项目（06-04）.
关键词
CU-AG-ZR合金
铜合金
再结晶
高强度
高导电
Cu-Ag-Zr alloy
copper alloy
recrystallization
high strength
high electrical conductivity
