摘要
通过钠硫电池中不锈钢与氧化铝部件的热压封接（ＴＣＢ）研究，详细讨论了该热压封接工艺参数（温度、压力、时间和铝箔厚度）之间相互关系，得出最佳工艺参数区为：Ｔ＝６００～６２５℃，Ｐ＝２５～７５ＭＰａ，ｔ＝１５～３０ｍｉｎ，δ＝０．３～０．７ｍｍ；最大封接强度为５７．５ＭＰａ；最小泄漏率为１０－１１Ｐａｍ３／ｓ。实验结果表明，该热压封接是密封连接钠硫电池中金属与陶瓷部件的最有效的途径，其可靠性在钠硫电池的实际试验中已经受了近２００００小时考验。
This paper describes the research on thermocompression bond (TCB) consisting of stainless steel/aluminium interlayers/alumina system in sodium sulfur cells. The effects of the bonding parameters of TCB including temperatures, pressures, times and aluminium foil thicknessies as ewll as assessment of quality and examination are discussed in detail. The optimum process of TCB is found. The max. bonding strength is 57.5 MPa and the min. rate of leakage is 10 -11 Pam 3/S. TCB is considered to be the most effective path for joints between metal and ceramic components in sodium sulfur cells. The dulability of TCB has been demostrated in sodium sulfur cells tested for near 20000h.
出处
《材料科学与工艺》
EI
CAS
CSCD
1997年第2期67-71,共5页
Materials Science and Technology
关键词
热压封接
扩散封接
密封
钠硫电池
蓄电池
Thermocompression bond
Diffusion hond
Seal
Sodium Sulfur cell
