期刊文献+

GaN MOS-HEMT Using Ultrathin Al_2O_3 Dielectric with f_(max) of 30.8GHz 被引量:1

f_(max)为30.8GHz的超薄Al_2O_3绝缘栅GaN MOS-HEMT器件(英文)
在线阅读 下载PDF
导出
摘要 We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) A1203 as the gate dielectric. Through decreasing the thickness of the gate oxide to 3.5nm,a device with maximum transconductance of 130mS/mm is produced. The drain current of this 1/~m gate- length MOS-HEMT can reach 720mA/mm at + 3.0V gate bias. The unity current gain cutoff frequency and maxi- mum frequency of oscillation are obtained as 10.1 and 30.8GHz,respectively. 报道了一种利用原子层淀积(ALD)生长超薄(3.5nm)Al2O3为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT).新型AlGaN/GaNMOS-HEMT器件栅长1μm,栅宽120μm,栅压为+3.0V时最大饱和输出电流达到720mA/mm,最大跨导达到130mS/mm,开启电压保持在-5.0V,特征频率和最高振荡频率分别为10.1和30.8GHz.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第11期1674-1678,共5页 半导体学报(英文版)
基金 国家重点基础研究发展计划资助项目(批准号:51327020301)~~
关键词 A1GAN/GAN MOS-HEMT ultrathin A1203 A1GaN/GaN MOS-HEMT 超薄Al2O3
  • 相关文献

参考文献4

二级参考文献39

  • 1Khan M A, Van Hove J M, Kuznia J N and Olsen D T 1991 Appl. Phys, Lett. 58 2408.
  • 2Shen L, Coffic R, Buttari D,Heikman S, Chakraborty A,Chini A, Keller S, DenBaars S P and Mishra U K 2004 IEEE Electron. Device Lett, 25 7.
  • 3Wu Y E, Saxler A, Moore M, Smith R P, Sheppard S,Chavarkar P M, Wisleder T, Mishra U K and Parikh P 2004 IEEE Electron Device Lett. 25 117.
  • 4Johnson J W, Piner E L, Vescan A, Therrien R,Rajagopal P, Roberts J C, Brown J D, Singhal S and Linthicum K J 2004 IEEE Electron. Device Lett. 25 459.
  • 5Hasegawa H and Oyama S 2002 J. Vac. Sci. Technol. B:Microclectron. Process, Phenom. 20 1647.
  • 6Khan M A, Hu X, Tarakji A, Simin G, Yang J, Gasket R and Shur M S 2000 Appl. Phys. Lett. 77 1339.
  • 7Hu X, Koudymov A, Simin G, Yang J and Khan M A 2001 Appl. Phys. Lett, 79 2832.
  • 8Khan M A, Simin G, Yang J W, Zhang J P, Koudymov A, Shur M S, Gaska R, Hu X H and Tarakji A 2004 IEEE Trans, Microwave Theory Technol, 51 624.
  • 9Liang J, Wu, H Z, Lao Y F, Qiu D J, Chen N B and Xu T N 2004 Chin. Phys. Lett. 21 1135.
  • 10Wu T, Hao Z B, Tang G and Luo Y 2003 Jpn. J. Appl.Phys. 42 L257.

共引文献9

同被引文献9

  • 1陈晓娟,刘新宇,和致经,刘键,邵刚,魏珂,吴德馨,王晓亮,周钧铭,陈宏.采用PECVD方法制作SiO2绝缘层的AlGaN/GaNMOS-HFET器件[J].电子器件,2005,28(3):479-481. 被引量:1
  • 2Khan M A,Shur M S,Chen Q C,et al,“.Current-voltage characteristic collapse in AlGaN/GaN heterostructure insulated gate field effect transistors at high drain bias”.Electron Lctt,1994,30(15)p:2175.
  • 3Okamoto Y,Ando Y,Nakayama T,Hataya K,Miyamoto H,Inoue T,Senda M,Hirata K,Kosaki M,Shibata N,Kuzuhara M“High-Power Recessed-Gate AlGaN–GaN HFET with a Field-Modulating Plate”.IEEE TRANSAC-TIONS ON ELECTRON DEVICES,51(12)2004p:2217-2219.
  • 4Moon J S,Shihchang Wu,Wong D,Milosavljevic I,Conway A,Hashimoto P,Hu M,Antcliffe M,Micovic M“Gate-Recessed AlGaN–GaN HEMTs for High-Performance Millimeter-Wave Applications”.IEEE ELECTRON DE-VICE LETTERS,200526(6)p:348-350.
  • 5Khan M A,Hu X,Tarakji A,et al.“AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistor”.Electron Lett,2000,36(8)p:2043.
  • 6Simin G,Hu X,Ilinskaya N,et al.“Large periphery high-power AlGaN/GaN metal-oxide-semiconductor heterostructure field effect transistors on SiC with oxide-bridging”.IEEE Electron Device Lett,2001,22(2)p:53.
  • 7Hu X,Kondymov A,Simin G,et al,“Si3N4/AlGaN/GaN metal-insulator-semiconductor heterostructure field-effect transistors”.Appl Phys Lett,2001,79(17)p:2832.
  • 8N.-Q.Zhang,S.Keller,G.Parish,et al,“High Breakdown GaN HEMT with Overlapping Gate Structure”.IEEE ELEC-TRON DEVICE LETTERS,VOL.21,NO.9,SEPTEMBER2000p:421-423.
  • 9Y.-F.Wu,A.Saxler,M.Moore,et al,“Field-plated GaN HEMTs and amplifiers”.Compound Semiconductor Integrated Cir-cuit Symposium,2005.CSIC'05IEEE30 Oct.-2Nov.2005p:170-172.

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部