摘要
We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) A1203 as the gate dielectric. Through decreasing the thickness of the gate oxide to 3.5nm,a device with maximum transconductance of 130mS/mm is produced. The drain current of this 1/~m gate- length MOS-HEMT can reach 720mA/mm at + 3.0V gate bias. The unity current gain cutoff frequency and maxi- mum frequency of oscillation are obtained as 10.1 and 30.8GHz,respectively.
报道了一种利用原子层淀积(ALD)生长超薄(3.5nm)Al2O3为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT).新型AlGaN/GaNMOS-HEMT器件栅长1μm,栅宽120μm,栅压为+3.0V时最大饱和输出电流达到720mA/mm,最大跨导达到130mS/mm,开启电压保持在-5.0V,特征频率和最高振荡频率分别为10.1和30.8GHz.
基金
国家重点基础研究发展计划资助项目(批准号:51327020301)~~