摘要
近年来,由于电子显微技术等先进测试手段的应用,使金属切削理论的研究进入了微观领域,用扫描电镜分析切屑形貌,可观察到切削过程中切屑的剪切前沿——层片结构的存在。许多学者对层片结构与切屑变形的关系进行了研究,Black等人的试验结果表明层片厚度随切削厚度的增大而增大,但两者之间不成比例关系。文献[2]、[3]指出“层片厚度越小,切屑变形愈小”,而文献[4][5]则认为“变形愈小,层片愈厚”,显然对层片厚度与切屑变形的关系方面存在着不同的观点。作者在超声振动切削的试验研究中,对这种切削与普通切削所得切屑层片结构进行了观测与分析,并对切屑层片与切屑变形的关系提出了自己的初步看法。
The experimental research for chip deformation in both Ultrasonic Vibration Cutting and conventional cutting is carried out by observing the surface topography of chips with SEM and analyzing the ralation between the shear front—lamellar structure and chip deformation in different cutting conditions. A concept of the coefficient of the lamellar thickness (CLT) is proposed and experimental results show that the less the CLT the less the chip deformation. The model of the chip formation in Ultrasonic Vibration Cutting process is also established.
出处
《东南大学学报（自然科学版）》
EI
CAS
CSCD
1989年第1期135-140,共6页
Journal of Southeast University：Natural Science Edition
关键词
金属
切削
切屑
超声振动
变形
metal cutting, chip, deformation, ultrasonic, vibration, scanning electron microscope
