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Te掺杂对TiCoSb基Half-Heusler化合物高温热电性能的影响 被引量:2

The High Temperature Thermoelectric Properties of Te-doped TiCoSb Half-Heusler Compounds
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摘要 采用固相反应法制备了Te掺杂的TiCoSb基half-Heusler化合物。X射线衍射分析表明,Te掺杂的TiCoSb化合物是单相。在300~850 K的温度范围内测量了材料的电阻率、赛贝克系数和热导率。结果表明:未经掺杂的TiCoSb化合物是n型半导体,在高温下有很高的赛贝克系数。在Sb位掺杂Te后,材料的电阻率和赛贝克系数的绝对值随着掺杂量的增加明显降低。材料的热导率随着掺杂量的增加而呈小幅度减小。Te掺杂后材料ZT值提高,最高的ZT值比基体提高了5倍多。 Half-Heusler compounds of Te-doped TiCoSb were prepared by solid-state reaction. XRD analysis confirmed that all the sample were crystallized in the single-phase. Their thermoelectric properties were measured in the temperature rang of 300-850 K. The un-doped TiCoSb compound shows n-type conduction and possesses high Seebeck coefficient at high temperatures. Te doping on Sb site results in a significant reduction of the electrical resistivity and Seebeck coefficient. The thermal conductivity also decreases little with increasing Te content. The maximum value of ZT is nearly 5 times larger than the un-doped TiCoSb compounds.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2007年第A02期412-414,共3页 Rare Metal Materials and Engineering
基金 国家杰出青年基金资助(50325208)
关键词 half-Hcuslcr化合物 TiCoSb 固相反应 热电性能 Half-Heusler compounds TiCoSb solid-state reaction thermoelectric properties
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参考文献7

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