摘要
通过对黑陶瓷封装工艺的研究，得到了理想的封装工艺条件，并建立了一条稳定性好、成品率高的封装工艺线。同时成功地封装了一些型号的电路，性能优异，通过了高可靠封装质量考核。
The packaging technology of glass sealed package was studied in this paper. We obtained ideal packaging conditions and set up a stable processing ling with high yields. Several types of ICs were packaged successfully. The characters of these ICs were excellent and passed the test of high reliable packaging.
出处
《微处理机》
1997年第2期22-24,共3页
Microprocessors
关键词
黑陶瓷
低熔玻璃
共晶粘结
IC
封装
glass sealed package, low melting glass, eutectic die attach
