摘要
为确定表面活性剂对化学镀镍体系的影响程度,采用紫外-可见分光光度计研究了固定工艺条件下苯磺酸钠(SBS)、十二烷基磺酸钠(SDS)、十二烷基苯磺酸钠(SDBS)、十二烷基羟基磺丙基甜菜碱(DHSB)、琥珀酸二(2-乙基己基)酯磺酸钠(AOT)等5种表面活性剂在铜基体上相对沉积量θ和吸附自由能ΔG的变化。结果表明,加入表面活性剂的ΔGS与未加表面活性剂的基础镀液的ΔGI差的绝对值小于3.5 kJ/mol;在含有表面活性剂的镀液体系中,固/液相界面所吸附的镍离子量存在一个限度;镀层沉积速率的高低与体系ΔG,ΔS,ΔH的值并不呈正相关性,影响该速率的能量基于化学能与镀层的结构及组成成分的差异所消耗的能量等方面。
In order to determine surfactants influencing degrees on electroless plating system, adding five kinds of surfactant such as sodium benzosulfonate （ SBS）, sodium dodecyl benzene sulfonate （ SDBS）, sodium dodecanesulphonate （SDS）, dodecyl hydroxysulfobetaine （DHSB） and sodium dioctyl sulfosuccinate （AOT） into the steady electroless plating Ni-P solution, the changes of relative deposition mass θ and Gibbs free energy of adsorption AGe on copper sheet were determined by UV-Vis spectrophotometry. The results show that influences of surfactants on adsorption nickel ion amount on solid-liquid interface exist a limitation, the absolute value of the variety between free energy of adsorption with surfactant △Gs and without △GI is less than 3.5 kJ/mol. Deposition rate of plating layer and △G, △S, △H is not a positive correlation, which indicates that the related energy is based on reaction chemical energy and consumption energy of the different structure and contents of the plating layer.
出处
《化学工程》
EI
CAS
CSCD
北大核心
2007年第9期37-40,共4页
Chemical Engineering(China)
基金
贵州省教育厅自然科学基金资助课题(2004222)
凯里学院院级重点课题(2005037)
